Strong adhesive properties on many surfaces

Electronic Materials

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For industries such as electronics, Unitech supplies high-performance adhesives for semiconductors.

Unitech’s Die attached adhesives and Underfill for chip adhesives has an outstanding flexibility on various condition and high protective properties.

DID YOU KNOW ?

Unitech Electronic Materials has an excellence in storage stability

  • Die Attached Adhesive for BOC PKG

    HIGH RELIABILITY

    Die attached Adhesives an epoxy based 1K adhesive material for BOC PKG. This adhesive has high thermal stability, high reliability, high modulus and low shrinkage in the process of semiconductor package.Especially, The material has a low migration on electronic path.

    • BENEFITS
    • COMPATIBILITY
    • Good screen printable
    • B-stage under D/A condition
    • High Reliability (JEDEC level)
    • Long working time
    • Good workability for various package and condition
    • Low modulus and low TG for high internal absorption
    • Highly thixotropic index for good printing profile
    • Customer Applicable specification: JEDEC LEVEL III
  • Underfill for Chip On Fim (COF)

    A MASTER OF FLEXIBILITY

    Chip-on- Film Underfillis used for flexible substrates as insulating material used in mounting technologies involving direct electrical connections between IC chips and mounting boards. Chip-on- Film Underfill has the ability to fill fine gaps and provides outstanding moisture resistance.

    • BENEFITS
    • COMPATIBILITY
    • 1 um Filtration, Non-filled type
    • Void-less and Long pot life (48hr)
    • Good Reliability for HTS, PCT, TC
    • Applicable with Flexible PCB
    • Customer Applicable specification: JEDEC Level I
  • Conductive Adhesive for PCB Substance

    PROTECTIVE PROPERTIES

    Screen printable Conductive Adhesive for PCB is an epoxy based 1K adhesive material. This adhesive can use for protecting Semiconductor device by thermal shock and has high level of adhesion strength. It is applied on area which requires high conductivity and reliability between PCB and devices, which improved adhesion.

    • BENEFITS
    • COMPATIBILITY
    • Electric interaction with high conductivity
    • Good Screen-printable
    • Excellent adhesion, and reliability
    • Low thermal shrinkage and warpage
    • Good solder ability with solder paste on electric path
    • Applicable with Gu, Cupanels
    • Customer Applicable specification: JEDEC LEVEL III