Strong adhesive properties on many surfaces

전자 산업

C

반도체와 같은 신성장 동력 산업에 적용되는 제품까지 유니테크 접착제 분야는 다양한 분야로 그 영역을 넓혀가고 있습니다.

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  • Die Attached Adhesive for BOC PKG

    HIGH RELIABILITY

    Die attached Adhesives an epoxy based 1K adhesive material for BOC PKG. This adhesive has high thermal stability, high reliability, high modulus and low shrinkage in the process of semiconductor package.Especially, The material has a low migration on electronic path.

    • BENEFITS
    • COMPATIBILITY
    • Good screen printable
    • B-stage under D/A condition
    • High Reliability (JEDEC level)
    • Long working time
    • Good workability for various package and condition
    • Low modulus and low TG for high internal absorption
    • Highly thixotropic index for good printing profile
    • Customer Applicable specification: JEDEC LEVEL III
  • Underfill for Chip On Fim (COF)

    A MASTER OF FLEXIBILITY

    Chip-on- Film Underfillis used for flexible substrates as insulating material used in mounting technologies involving direct electrical connections between IC chips and mounting boards. Chip-on- Film Underfill has the ability to fill fine gaps and provides outstanding moisture resistance.

    • BENEFITS
    • COMPATIBILITY
    • 1 um Filtration, Non-filled type
    • Void-less and Long pot life (48hr)
    • Good Reliability for HTS, PCT, TC
    • Applicable with Flexible PCB
    • Customer Applicable specification: JEDEC Level I
  • Conductive Adhesive for PCB Substance

    PROTECTIVE PROPERTIES

    Screen printable Conductive Adhesive for PCB is an epoxy based 1K adhesive material. This adhesive can use for protecting Semiconductor device by thermal shock and has high level of adhesion strength. It is applied on area which requires high conductivity and reliability between PCB and devices, which improved adhesion.

    • BENEFITS
    • COMPATIBILITY
    • Electric interaction with high conductivity
    • Good Screen-printable
    • Excellent adhesion, and reliability
    • Low thermal shrinkage and warpage
    • Good solder ability with solder paste on electric path
    • Applicable with Gu, Cupanels
    • Customer Applicable specification: JEDEC LEVEL III